Question Bank

MICROPROCESSOR

I Fill in the blanks:-

1. AMD stands for ----- Ans: Advanced Micro Device.
2. L1 cache on Athlon is ------- KB. Ans: 128
3. MCA stands for ----- Ans: Micro channel Architecture
4. “Katmai” stands for ------ Ans: Pentium III
5. Modern Celeron processors were made using ----- package. Ans: FC PGA
6. 6X86 processors are introduced by ------ Ans: Cyrix
7. ------ was the chipset that supports Pentium Pro. Ans: 440 FX
8. PPGA stands for ----- Ans: Plastic Pin Grid Array
9. Athlon has ----- L1 cache. Ans: 128 KB
10. Celeron was introduced in ------- Ans: 1998.
11. The smallest unit of time at which processing takes place is called ------
Ans: clock.
12. --- is a technique used by Pentium 4 that causes 400 MHz data transfer to occur in 100 MHz bus. Ans: Quad pumping.
13. SIMD stands for ---- Ans: Single Instruction Multiple Data
14. MIMD stands for ----- Ans: Multiple Instruction Multiple Data.
15. Number of USB ports supported by Intel 850E chipset is ----- Ans: 4
16. Maximum memory supported by Intel 440ZX is ---- Ans: 256 MB
17. SISD stands for --- Ans: Single Instruciton Single Data.
18. ISA stands for ----- Ans: Industry Standard Architecture.
19. EISA stands for ----- Ans: Extended Industry Standard Architecture.
20. 64 bit processors introduced by AMD is named as ---- Ans: Athlon 64.
21. --- technology allows the processor to execute more than one instruction in a ---- single clock cycle. Ans: pipelining.
22. Pentium 3 had an L2 cache for ---- KB initially. Ans: 512.
23. Early Pentium models used a supply voltage of ---- volts. Ans: 5
24. 815E can support a maximum of ---- USB ports. Ans: 4
25. Apollo chipset was introduced by ----- Ans: VIA.
26. Original 8 bit XT bus was developed by ----- Ans: IBM
27. The chip responsible for communicating with external devices is called a ---- Ans: South Bridge Chip.
28. Modern Celeron Processors were made using ---- package. Ans: FC- PGA.
29. PCI stands for ---- Ans: Peripheral component interconnect.
30. SEC stands for ---- Ans: Single Edge contact.
31. BGA stands for ---- Ans: Ball Grid Array.
32. RIMM stands for ---- Ans: Real Inline Memory Module.
33. RTOS stands for ---- Ans: Real Time Operating system.
34. ALU stands for ---- Ans: Arithmetic and Logic Unit.
35. CPU stands for ---- Ans: Central Processing Unit.
36. AMD 760 chipset can support upto ---- RAM. Ans: 4GB
37. ---- chipsets conforms to Microsoft PC99 standard. Ans: AMD 750
38. The Intel chipset that supports Pentium 4 Processor and RD RAM is ---- Ans: D 850
39. --- is scaled down version of AMD Athlon. Ans: Duron.
40. ------ is the practice of reconfiguring a PC to operate a CPU at a higher clock speed than the normal speed. Ans: overclocking.
41. RISC stands for ----- Ans: Reduced Instruction Set Computer
42. CISC stands for ---- Ans: Complex Instrucion Set Computer.
43. MMX stands for ---- Ans: Multimedia Extension.
44. VESA stands for ---- Ans: Video Electronic Standard Association.
45. SSI stands for ---- Ans: Small Scale Integration.
46. DIMM stands for ---- Ans: Dual Inline Memory Module.
47. SIMM stands for ---- Ans: Single Inline Memory Module.
48. DIP stands for ----- Ans: Dual Inline Package.
49. The technology that doubles the pipeline depth of the older P6 architecture is --- Ans: Hyperpipelining.
50. PGA stands for ----- Ans: Pin Grid Array.
51. 8 bit ISA bus has ----- address lines. Ans: 20
52. In EISA bus the transfer rates can reach upto ----- MB per second. Ans: 33
53. In VESA Local Bus the transfer rates exceeded ----- MB per second. Ans: 100
54. MMX technology was incorporated to Pentium processors in ---- Ans: 1996
55. Size of K6 Data cache is ---- Ans: 32 KB
56. Amount of cache in a Pentium Pro processor is ----- Ans: 1 MB
57. Modern Celeron processors use ---- packaging. Ans: FCPGA
58. Intel’s 64 bit processor is ------ Ans: ITANIUM
59. The processor developed by AMD to compete with Intel Celeron is ---- Ans: Duron
60. IDE stands for ----- Ans: Integrated Drive Electronics.

State True or False.

1. ISA bus is inferior to MCA bus. F
2. FCPGA stands for Final Chip Pin Grid Array. F
3. Intel 810 Chipset supports 4 USB ports. F
4. Number of USB ports supported by Intel 850E chipset is 5. F
5. Intel 845GL chipset supports both SDRAM and DDR SDRAM. T
6. Maximum memory supported by Intel 440ZX is 256MB. T
7. XEON processors support dual processors. T
8. D845 can support RDRAM. F
9. Athlon processor architecture does not support scalable multiprocessing F
10. Intel 815 supports graphics technology. T
11. Celeron can be used to implement dual processor systems. F
12. Upgrade from a K6-2 to K6-3 processor requires a BIOS upgrade. T
13. AGP sets are chipsets that control AGP bus. T
14. AMD K6-2 ahs “3D now” technology. T
15. Intel 820 chipset supports RDRAM. F
16. PCI bus supports error detection and reporting. T
17. MMX technology was introduced by AMD. F
18. AMD is the largest manufacturers of processors. F
19. Intel 845 GL chipset supports both SDRAM and DDR SDRAM. T
20. Intel D845G chipset have AGP 8X support. F
21. AMD 750 chipset supported AGP 2X. T
22. Intel 815 chipset supported SDRAM as well as RDRAM. F
23. Intel 850 supported a maximum of 2 GB RAM. T
24. L1 cache on Athlon is 256 KB. F
25. 6x86 processors are introduced by Duron. F
26. Number of USB ports supported by Intel 810 chipset is 4. T
27. The smallest unit of time at which processing takes place is called cycle. F
28. Quad pumping is a technique used by Pentium 4. T
29. AMD means Advanced micro devices. T
30. AMD 760 chipset can support upto 10 GB RAM. F
31. AMD 750 chipsets conforms to MS PC99 standard. T
32. The Intel chipset that supports Pentium 4 Processor and RDRAM is D 850. T
33. Duron is a scaled down version of AMD Athlon. T
34. Celeron was introduced in 1996. F
35. PPGA means Plastic Pin Grid Array. T
36. Hyperpipelining is a technique that doubles the depth of the P6. T
37. 8 bit ISA bus has 30 address lines. F
38. In EISA bus the transfer rates cn reach upto 45 MB per second. F
39. In VESA local bus data transfer rates exceeded 100 MB per second. T
40. MMX technology was incorporated to Pentium processors. T
41. Size of K6 Data cache is 32 KB. T
42. Amount of cache developed in a Pentium Pro processor is 1 MB. T
43. Modern Celeron processors use BGA packaging. F
44. Intel’s 64 bit processor is Duron. F
45. The processor developed by AMD to compete with Intel Celeron is Athlon. F
46. It is possible to upgrade a CPU. T
47. RISC contains relatively few instructions. T
48. CISC is a computer with a large number of instructions. T
49. IBM 370 is a RISC computer. F
50. CISC contains variable length instruction formats. T
51. A system bus has 100 signal lines. T
52. A parallel bus uses a encoder and a decoder. T
53. A bus system uses polling. T
54. The first micro processor was introduced by Intel. T
55. The latest micro processor is 64 bit. F
56. There is no difference between SIMM and DIMM. F
57. A SIMM plugs into a computer’s memory expansion socket. T
58. 80286 is available as 68 pin packages. T
59. AMD uses socket 7 standard. T
60. Cyrix uses socket 6 standard. F
SHORT QUESTIONS

1. What is the difference between AMD Duron and AMD Athlon XP.
2. What are the features of 815E and 845 GL chipset.
3. What is CPU overclocking.
4. What are the peculiar features of Pentium IV processor? Explain.
5. Write the functions of North Bridge and South Bridge chips.
6. What are the server class chipsets.
7. Explain any 2 packaging techniques.
8. Explain any three server class chipsets and their unique features.
9. What are the peculiar features of Pentium IV processor.
10. What is PCI bus.
11. What are the advantages of PCI over ISA bus.
12. Explain various processor generations.
13. What are the various steps involved in troubleshooting a CPU.
14. What are the various steps in troubleshooting a bus.
15. Comment on Pentium socket compatibility.
16. Explain various socket types used in processssor.
17. Explain PGA.
18. Explain DIP.
19. Explain MCA bus architecture.
20. What is DIMM
21. What is SIMM.
22. Explain MMX technology.
23. Explain the features of 810 Chipset.
24. What are the features of AMD 760 chipset.
25. What are the features of AMD 750 chipset.
26. What are the features of Athlon MP.
27. What are the features of Cyrix MII
28. What are the features of Cyrix MIII.
29. What are the features of AMD Opeteron.
30. What are the features of AMD Duron.
31. What is 3D now technology.
32. What is IDE.
33. Write short notes on CPU upgrade.
34. What is RIMM.
35. What are the advantages of AMD 760 MPX.
36. What is SIPP.
37. What is expansion bus.
38. Explain the functions of I/O Controller.
39. Difference between SDRAM and DRAM.
40. What is SPGA.
41. What is SEC.
42. What is burst static RAM.
43. What makes a bus fail.
44. Explain BGA.
45. Explain EISA bus architecture.
46. What are RISC processors.
47. What are CISC processors.
48. Explain any three non Intel chipsets.
49. What are the applications of Pentium III Xeon Processor? Explain its features.
50. Compare and contrast Pentium 4 and Athlon processors.
51. What is the difference between server class chipsets and desktop chipsets.
52. What are the factors we should consider while selecting a chipset.
53. Explain the steps involved in the fabrication of the processor.
54. What are the various packaging techniques.
55. What are the limitations of 8 bit ISA bus.
56. What are the advantages of 16 bit ISA bus.
57. What are the features of Pentium Pro.
58. What are the features of Celeron.
59. What are the features of K5.
60. What are the features of Pentium III.

ESSAYS:

1. What are RISC and CISC processors? What is expansion bus.
2. Explain various processor generations.
3. Explain any three non Intel chipsets and compare them.
4. What are the various steps involved in trouble shooting a bus.
5. What are the various steps involved in trouble shooting a processor.
6. Compare and contrast AMD K5 and Intel Pentium2
7. Compare and contrast AMD K7 and Intel Pentium 3
8. Compare and contrast AMD Athlon XP and Intel Pentium 4
9. Compare and contrast AMD 750 and AMD 760 chipset.
10. Compare and contrast Cyrix M II and Athlon MP.
11. Compare and contrast Cyrix M III AMD Duron.
12. Compare and contrast Celeron and AMD Duron.
13. What is a system bus. What are the various bus architectures developed. Explain their features.
14. Compare and contrast Pentium Pro and Pentium III.
15. Compare and contrast Duron and Celeron.
16. Compare and contrast K5 and Pentium Pro.
17. Explain the various packaging techniques.
18. Explain the various fabrication techniques.
19. Compare and contrast DIMM and SIMM.
20. Compare and contrast SIMM and RIMM.
21. Compare and contrast DIMM and RIMM.
22. What are the limitations of 8 bit ISA bus. How is it overcame in 16 bit ISA bus.
23. What are the advantages of MCA over PCI.
24. Explain the various sockets used in Pentium.
25. Explain the VESA bus architecture.
26. What is local bus. How does it differ from EISA.
27. Describe the evolution of microprocessor.
28. What are the functions of I/O controllers?
29. What is a microprocessor? What are the parts of a microprocessor?
30. Give any five 8085 instructions for data transfer.